Moisture Bake-Out

Moisture Bake-Out

Many surface mount components manufactured with moisture-permeable materials may be susceptible to damage during the SMT high temperature re-flow process when the absorbed moisture inside the components expands. The expansion of trapped moisture can result in the internal separation or delamination of the plastic from the die or lead frame, damage to the die itself, wire bond damage or internal cracks. In most instances this type of damage is not visible on the component surface, but in extreme cases the stress can result in external package cracks. In the most severe cases of trapped moisture expansion, the component body will bulge and pop. This phenomenon is known as the "popcorn" effect.

Following moisture bake-out and slow cool, the components are packaged in the specified format promptly to minimize the exposure time thereby re-setting the floor life of the components or assemblies.

Electro-Comp's moisture bake-out services and subsequent vacuum dry-packing are performed to the most current revisions of JEDEC J-STD-020, J-STD-033, JEP113 and to specific customer requirements.

As an added benefit, Electro-Comp’s vacuum dry-pack service utilizes a technique called Modified Atmosphere Packaging (MAP) or Gas Flush. Free oxygen is a major contributor in the deterioration of component leads. The most effective way to prevent oxygen damage or oxidation is to remove and replace the oxygen with an inert gas. Inert gases used for MAP are typically denser than oxygen. As such, when vacuum packing, the remaining oxygen inside the Moisture Barrier Bag (MBB) is forced out when the inert gas is injected into the bag. Utilizing this technique offers protection against component lead oxidation and potentially an extended product shelf life.